In an era where optical sensing, 3D vision, and AI hardware are deeply integrated, depth cameras have transitioned from the laboratory into core sectors such as industrial automation, intelligent robotics, autonomous driving, biometrics, and 3D reconstruction.
The explosive growth of Artificial Intelligence (AI) and High-Performance Computing (HPC) chips is profoundly reshaping the boundaries of modern microelectronic packaging and circuit board manufacturing technologies.
Modern AI processors—whether they are massively parallel GPUs, specialized deep-learning TPUs, high-performance ASICs, or complex computing units utilizing chiplet architectures and 2.5D/3D heterogeneous integration—have surpassed the threshold of 100 billion transistors.